Customized Semiconductor Silicon Carbide Ceramic Wafer Carrier Sic Boat for Lpcvd Process

• Customization: Available
• Corrosion Resistance: Acid Resistant
• Application: Electronics, Refractory, Industrial Ceramic
• Model NO.: HBQ-D004
• Type: Ceramic Part
• Materials: Silicon Carbide Ceramic
• Size: as Per Drawing
• Usage: Semiconductor or Photovoltaic
• Denisty: >3.12g/cm3
• Feature: High Purity
• Keywords: Customized Semiconductor Silicon Carbide Ceramic W
• Transport Package: Export Wooden /Carton Box
• Specification: We can process as your requirement
• Trademark: BAIBO
• Origin: Jiangsu, China (Mainland)
• Production Capacity: 2000000pieces\\Month
• Package Size: 10.00cm * 10.00cm * 10.00cm
• Package Gross Weight: 10.000kg

Product Description

Product Description

Customized High Purity Silicon Carbide Wafer Boat SiC Ceramic Wafer Carrier for LPCVD Semiconductor Process

silicon carbide wafer boat SiC wafer carrier LPCVD ceramic boat semiconductor wafer carrier high purity SiC boat low pressure CVD wafer holder custom wafer processing boat semiconductor ceramic wafer tray SiC wafer jig wafer processing fixture semiconductor process consumable 6 inch 8 inch wafer boat

Product Description

This customized silicon carbide wafer boat is a high precision ceramic wafer carrier manufactured from high purity silicon carbide material through advanced sintering and precision machining processes. It is specially designed for wafer loading and transportation in LPCVD Low Pressure Chemical Vapor Deposition processes, serving as a critical process fixture for semiconductor wafer fabrication lines.
Compared with traditional quartz and alumina wafer carriers, the high purity SiC ceramic matrix delivers outstanding performance in high temperature stability, contamination control and service life, meeting the strict cleanliness and process requirements of semiconductor manufacturing. The material features extremely low metal impurity content and minimal particle generation under high temperature and plasma conditions, effectively reducing metal contamination and particle defects on wafer surfaces and improving process yield.

Features

*Excellent high temperature stability and thermal shock resistance, withstands repeated thermal cycling in LPCVD processes, maintains structural integrity without cracking or deformation
*High thermal conductivity ensures uniform temperature distribution across the wafer stack, improves film thickness uniformity and process yield
*Precision machined wafer slots with accurate positioning and gentle edge support, avoids wafer damage and ensures uniform gas flow between wafers
*Resistant to process gas corrosion and plasma erosion, maintains stable surface condition under long term process exposure with extended service life
Applications
Wafer loading and transportation in LPCVD low pressure chemical vapor deposition processes for semiconductor manufacturing
High temperature wafer processing including diffusion, annealing and oxidation in semiconductor fabrication lines
Wafer carrying fixtures for horizontal and vertical LPCVD furnace tubes and other high temperature process equipment

Item		SSIC	RBSIC/SISIC	RSIC
	UNIT	DATA	DATA	DATA
Max temperature of Application	℃	1600	1380	1650
Density	g/cm3	>3.1	>3.02	>2.6
Open Porosity	%	<0.1	<0.1	15%
Bending Strength	MPa	>400	250(20℃)	90-100(20℃)
	MPa		280(1200℃)	100-120(1100℃
Modulus of Elasticity	GPa	420	330(20℃)	240
	GPa		300(1200℃)
Thermal Conductivity	W/(m·K)	74	45(1200℃)	24
Coefficient of Thermal Expansion	K-1x10-6	4.1	4.5	4.8
Vickers Hardness HV	GPa	22	20
Acid Alkaline-proof		excellent	excellent	excellent

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Q1: Can you provide exclusive customized solutions for special project demands? 
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Q5: What customized service items can you support besides product structure? 
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