Active Metal Brazing Amb-Aln Metallized Ceramic Substrates Dbc/Dpc Alumina with Copper Coating
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Product Highlights
- Customized Conducting Layer: Conducting layer thickness ranges from 0.5um to 1mm or can be customized to specific requirements.
- High Thermal Conductivity: Features excellent thermal conductivity and low coefficient of expansion for high-power electronics.
- Wide Material Options: Available in Alumina, Aluminum Nitride (AlN), Beryllium Oxide (BeO), and Silicon Nitride (Si3N4).
- Customizable Surface Finish: Surface options include Bare Copper, Nickel Plating, or Gold Plating based on customer needs.
- High Strength Performance: Pin full strength reaches 4200kgf/cm2 average, ensuring durability in demanding applications.
- OEM/ODM Services: Full customization available for designs, shapes, and specifications according to client drawings.
- Global Export Capability: Exporting to over 108 countries with professional logistics and direct sales support.
Product Attributes
- Customization
- Available
- Application
- Aerospace, Electronics, Electronic Devices, Power Supply, Semiconductors
- Type
- Ceramic Plate
- Model NO.
- HBQ-E006
- Technology
- Dbc/Dpc/Awb/Brazing
- Material of Substrate
- Aln/Al2O3/Beo/Si3n4 etc
- Conducting Layer
- 0.5um-1mm or Customized
- Film
- Single/Double
- Surface
- Bare Cu/Ni-Plating/Au Plating
- Feature
- Electrical Insulation/ High Thermal Conductivity
- Usage
- Thick Film Circuit, Large-Scale Integrated Circuit
- Keywords
- Customized Amb Metallized Aln Aluminum Nitride Cer
- Transport Package
- Export Packing
- Specification
- Customized
- Trademark
- BAIBO
- Origin
- China(Mainland); Jiangsu
- Production Capacity
- 2000000pieces\\Month
- Package Size
- 10.00cm * 10.00cm * 10.00cm
- Package Gross Weight
- 10.000kg
Shipping
- Shipping Cost:
- Contact the supplier about freight and estimated delivery time.
Online Trading Protection
- Payment Guarantee
-
Platform-protected payments with refund support for eligible order issues.
- Platform Logistics
- Clearer shipment tracking with platform-supported logistics.
- Inspection Service
- Optional pre-shipment inspection for quality and quantity checks.
- After-Sales & Dispute Handling
- Platform-assisted dispute resolution, including refunds or returns when applicable.
Only orders placed and paid through Made-in-China.com Secured Trading are eligible for payment protection and the corresponding platform services.
Product Images of Active Metal Brazing Amb-Aln Metallized Ceramic Substrates Dbc/Dpc Alumina with Copper Coating
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Active Metal Brazing Amb-Aln Metallized Ceramic Substrates Dbc/Dpc Alumina with Copper Coating -
Active Metal Brazing Amb-Aln Metallized Ceramic Substrates Dbc/Dpc Alumina with Copper Coating -
Active Metal Brazing Amb-Aln Metallized Ceramic Substrates Dbc/Dpc Alumina with Copper Coating -
Active Metal Brazing Amb-Aln Metallized Ceramic Substrates Dbc/Dpc Alumina with Copper Coating -
Active Metal Brazing Amb-Aln Metallized Ceramic Substrates Dbc/Dpc Alumina with Copper Coating -
Active Metal Brazing Amb-Aln Metallized Ceramic Substrates Dbc/Dpc Alumina with Copper Coating -
Active Metal Brazing Amb-Aln Metallized Ceramic Substrates Dbc/Dpc Alumina with Copper Coating
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Product Description
Customized AMB DBC Technology Direct Bond Copper Metallized Alumina Ceramic Substrate with good copper bonding force
96% Alumina Ceramic is commonly used for production of electric circuit ceramic substrates, it is most frequently used ceramic
substrates becasue of its excellent advantages:
- High thermal conductivity
- Low coefficient of expansion
- High strength
- High temperature resistance
- Chemical resistance
- High resistivity
- Small dielectric constant
- No toxicity
| Product Name | Aluminum Nitride AlN Macor Al2o3 DBC DPC AMB Metallized Ceramic Substrate With Copper Coating |
| Material | Alumina/Aluminum nitride |
| Metal | Copper/Au/Ni |
| Size | As per drawing |
| Payment | T/T,Western Union,Online payment by credit card are available |
| Application | it is widely used in High-power electronic coDbc/Dpc Direct Bond Copper Aluminum Oxide AL2O3 Metallized Ceramic Substrate mponents. |
| Thransport | Air transport: 5-10 days; Ocean shipping: About one month. |
| Delivery Time | 1.stock:delivery within 3-5 days after receiving your payment. 2. OEM/ODM:The normal Lead time is 15-45 days, which depends on your quantiy. |
substrates becasue of its excellent advantages:
- High thermal conductivity
- Low coefficient of expansion
- High strength
- High temperature resistance
- Chemical resistance
- High resistivity
- Small dielectric constant
- No toxicity
Ceramic metallization is critical in making strong and dependable joints between ceramic and metal parts, which ensures the smooth functioning of many sophisticated applications. This process consists of plating a metal layer on the ceramic surface in order to assist in joining ceramics with metals, typically through brazing. Its integration in industries such as power electronics packaging and sensor technology is urgent because ceramic metallization makes it possible to utilize the high thermal stability, hardness, and other excellent properties of ceramics along with the conductivity and mechanical strength of metals.
Specification
>Metallization thickness: 25 ±10um
>Nickel thickness:2~10um;
>Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)
Available Ceramic Composition
>Nickel thickness:2~10um;
>Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)
Available Ceramic Composition
>95%,96% Alumina Ceramic Components;