Customized AMB DBC Technology Direct Bond Copper Metallized Alumina Ceramic Substrate with good copper bonding force
Product Name |
Mo Mn Aluminum Nitride AlN Macor Al2o3 DBC DPC AMB Metallized Ceramic Substrate With Copper Coating |
Material |
Alumina/Aluminum nitride |
Metal |
Copper/Au/Ni |
Size |
As per drawing |
Payment |
T/T,Western Union,Online payment by credit card are available |
Application |
it is widely used in High-power electronic coDbc/Dpc Direct Bond Copper Aluminum Oxide AL2O3 Metallized Ceramic Substrate mponents. |
Thransport |
Air transport: 5-10 days; Ocean shipping: About one month. |
Delivery Time |
1.stock:delivery within 3-5 days after receiving your payment.
2. OEM/ODM:The normal Lead time is 15-45 days, which depends on your quantiy. |
96% Alumina Ceramic is commonly used for production of electric circuit ceramic substrates, it is most frequently used ceramic
substrates becasue of its excellent advantages:
- High thermal conductivity
- Low coefficient of expansion
- High strength
- High temperature resistance
- Chemical resistance
- High resistivity
- Small dielectric constant
- No toxicity
Ceramic metallization is critical in making strong and dependable joints between ceramic and metal parts, which ensures the smooth functioning of many sophisticated applications. This process consists of plating a metal layer on the ceramic surface in order to assist in joining ceramics with metals, typically through brazing. Its integration in industries such as power electronics packaging and sensor technology is urgent because ceramic metallization makes it possible to utilize the high thermal stability, hardness, and other excellent properties of ceramics along with the conductivity and mechanical strength of metals.
>Metallization thickness: 25 ±10um
>Nickel thickness:2~10um;
>Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)
Available Ceramic Composition
>95%,96% Alumina Ceramic Components;