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Electronic Direct Bond Copper Aln Plate High Thermal Conductivity Customized Dbc Aluminum Nitride Ceramic Substrate

Name: Electronic Direct Bond Copper Aln Plate High Thermal Conductivity Customized Dbc Aluminum Nitride Ceramic Substrate
Brand: LIANYUNGANG BAIBO NEW MATERIAL CO., LTD.
SKU: zyTJRauPYwcK
Price: 10.00 USD
Availability: InStock

Electronic Direct Bond Copper Aln Plate High Thermal Conductivity Customized Dbc Aluminum Nitride Ceramic Substrate pictures & photos

Application:	Refractory, Industrial Ceramic
Type:	Ceramic Plates
Color:	Ivory
Density:	3.3 g/cm3
Size:	Customized
Thermal Conductivity(30°c, W/M.K):	>170

Samples:	US$ 20/Piece 1 Piece(Min.Order) \| Request Sample

Customization:	Available \| Customized Request

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